L&O Travel Scholarship for Design Innovation

Maximum HK$40,000 for a two-week travel study programme on a particular architectural topic and a certificate, for up to two students who demonstrate an outstanding ability in architectural design and strong potential for further development.

Target Students

  • BSSc3

Application/Nomination Period

Not available in AY2020-21

Recipients 2018-19

  • ALBRECHT, Robin
  • JIAO Keqing, Clara

Recipient 2019-22

CHEUNG Ka Ming

Other Scholarships & Awards

All
BSSc1
BSSc2
BSSc3
BSSc4
MArch
PhD
RPg
University
MSUD
MPhil
Studio
Electives
Required
Copyright © 2025 School of Architecture
The Chinese University of Hong Kong
Privacy Policy
Disclaimer